WCSM-2023
★ Scientific Programme


Smart Materials-2023

Time: March 15-17, 2023

Venue: Barcelona, Spain

 

Plenary

Scientific Program

Stream 1

Stream 2

Stream 3

Stream 4

Stream 5

Poster & Paper

Stream 6

Stream 7

Stream 8

Stream 9

Stream 10

 

Please Attention:
The below program are not the confirmed version, the program will be mini changed according to the situation of each session before conference date. For the conference program layout, please click HERE

 

Stream 4: Smart Electronic Materials & Devices

  

Session 401: Electronic & Advanced Packaging Materials and Technology

Time: 08:30-12:10, March 16, 2023  

Place: Catalonia Barcelona Plaza

Chair:

Call for Chair

Co-Chair:

Call for Co-Chair

08:30-08:55

 Keynote Speech
Title: Wetting and Interfacial Reactivity during Electronic Packaging Prcesses
Dr. Fiqiri Hodaj, Professor, Grenoble Institute of Technology, France

08:55-09:20

 Title: New Materials and Processes for Advanced Ceramic Packaging and Heterogeneous Integration
Mr. Marc Bochard, R&D Department Manager, VIA electronic GmbH, Germany

09:20-09:45

Title: Development of PID Material for Top Thin Layer and Inner Layer Insulation
Mr. Toshizumi Yoshino, Director, Hitachi Chemical Co., Ltd., Sweden

09:45-10:10

Title: Next Generation Dry Film Solder Resist for System-in-Package
Dr. Yuya Suzuki, Marketing Manager, Taiyo America, USA

10:10-10:30

Coffee Break

10:30-10:55

Title: Reconfigurable 2D Electron Gases in Ferroelectric Domain Walls

Dr. Lukas Eng, Professor, Technical University Dresden, Germany

10:55-11:20

Title: Large Area Ionized Magnetron Sputtering Concept for Directional Deposition in Advanced Packaging

Dr. Juergen Weichart, Principal Scientist, Evatec AG, Switzerland

11:20-11:45

Speech Opportunity Available
11:45-12:10 Speech Opportunity Available

 

 

Session 402: Novel Display and Imaging Device

Time: 08:30-12:10, March 16, 2023

Place: Catalonia Barcelona Plaza

Chair:

Mr. Joe Miseli, CEO & Principal, JVM Research, USA

Co-Chair:

Call for Co-Chair

08:30-08:55

Title: Evaluation of the Dynamic Performance of HDR Displays

Mr. Joe Miseli, CEO & Principal, JVM Research, USA

08:55-09:20

Title: Trends on Visual Communication Technologies towards Immersive, Natural Experiences
Dr. Seishi Takamura, Senior Distinguished Engineer, NTT Media Intelligence Laboratories, NTT Corporation, Japan

09:20-09:45

Title: Applications of High-speed Imaging to Sport Dynamics
Dr. Shinichiro Ito, Professor, Kogakuin University, Japan

09:45-10:10

Title: Industrial Evolution of Polymer Dispersed Liquid Crystal Film Technology for Smart Glass Application

H. Hakemi, Plastic Liquid Crystal Technology, Italy

10:10-10:35

Speech Opportunity Available

 

 

Session 403: Stretchable and Flexible Electronic Materials & Devices

Time: 08:30-12:10, March 17, 2023

Place: Catalonia Barcelona Plaza

Chair:

Dr. Michel Popovic, Director, IN-CORE Systemes, France

Co-Chair:

Dr. Anna Vilà, Associate Professor, University of Barcelona, Spain 

08:30-08:55

Title: Digitalization and Traceability Challenges in the Printed Electronic Industry
Dr. Michel Popovic, Director,  IN-CORE Systemes, France

08:55-09:20

Title: Printed Structural Electronic and Device Integration on Metal
Dr. Guaino Philippe, Program Leader, CRM Group, Belgium

09:20-09:45

Title: Substituent Effects in Nitrogen-based ZnO Precursors for Printed Electronics

Dr. Anna Vilà, Associate Professor, University of Barcelona, Spain

09:45-10:10

Title: Stress Comparison between Working and Relaxing with Woman’s Wearable Smart Underwear
Dr. Sheng -fu Chiu, Taiwan Textile Research Institute (TTRI), Taiwan

10:10-10:35

Speech Opportunity Available

 

 

Session 404: Next Generation for IT/ICT

Time: 08:30-12:10, March 17, 2023  

Place: Catalonia Barcelona Plaza

Chair:

Dr. François Jeanjean, Economist, Orange, France

Co-Chair:

Call for Co-Chair

08:30-08:55

Keynote Speech

Title: How Smart Materials Are Revolutionising Machine Learning and Interfaces
Dr. Jim Clark, Adjunct Professor, University of Maryland Global Campus, USA

08:55-09:20

Title: Technical Progress Reduces the Degree of Competition that Maximizes Investment in Innovation

Dr. François Jeanjean, Economist, Orange, France

09:20-09:45

Title: Radar-- The Underestimated Sensor
Mr. Josef Worms, Team Leader, Fraunhofer Institute for High Frequency Physics and Radar Techniques FHR, Germany

09:45-10:10

Title: Smart Materials and Future Industrial Wireless Sensor Network: Are we really Taking Advantage on These Technological Improvements?

Mr. Richard J. R. McCullough, Managing Director, ITIBCN (DATAGROUP), Spain

10:10-10:30

Coffee Break

10:30-10:55

Title: Innovative IT Approaches -Digitisation and Smart Vocational Learning in the Field of European Metal Industry

Dr. Marc Beutner, Chair Professor, Chair Business and Human Resource Education II, University Paderborn, Germany

10:55-11:20

 Speech Opportunity Available

11:20-11:45

Title: Subsurface Target Detection by Undersampled Data: Experimental Results
Dr. Adriana Brancaccio, Associate Professor, University of Campania Luigi Vanvitelli, Italy

11:45-12:10

Title: The IEEE 802.11p for VANETs

Mr. Osman Toker, Software Engineer, Havelsan A.S., Turkey

 

 

Session 405: Integrated Circuit and Semiconductor

Time: 13:30-17:10, March 17, 2023   

Place: Catalonia Barcelona Plaza

Chair:

Call for Chair

Co-Chair:

Call for Co-Chair

13:30-13:55

Speech Opportunity Available

13:55-14:20

Title: TBD
Dr. Tarek Djerafi, Professor, National Institute of Scientific Research (INRS), Canada

14:20-14:45

Title: TBD
Dr. Konstanty Marszalek, Researcher, AGH University of Science and Technology, Poland

14:45-15:10

Title: Nanoscale Non Volatile Memories – A Paradigm Shift
Mr. Mayank Chakraverty, Senior Staff Engineer, ams AG, India

 

 

Session 406: Optical Communication and 5G Technology 

Time: 13:30-17:10, March 17, 2023

Place: Catalonia Barcelona Plaza

Chair:

Call for Chair

Co-Chair:

Call for Co-Chair

13:30-13:55

Speech Opportunity Available

13:55-14:20

Title: TBD
Mr. Tomislav Drenski, Principal Business Program Manager (PME), Socionext Europe, UK

14:20-14:45

Speech Opportunity Available

14:45-15:10

Title: Substrate Integrated Waveguide Technology for 5G Wireless Sensors
Dr. Kundan Kumar, Assistant Professor, Sant Longowal Institue of Engineering and Technology, India

 

Hosting Organization

National Foreign Experts Databank of MOST (Dalian Branch)

Sponsor

Agilent Technologies Inc.
Exhibitor

The Institution of Engineering and Technology

Supporting Organization
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Format of Abstract
Media Partners

Comments on WCSM Events

I enjoyed the conference and city of Rome. The conference involves wide variety of topics with many especially companies. It was exciting to me. I hope WCSM-2023 will be successful one.

---- Dr. Masaaki Niwa, Japan

 

Thank you for the wonderful conference which you and your team had organized in Osaka Japan. The talks were of really high quality and the opportunity to network amongst the participants was very beneficial.

----Dr. Brando Okolo, Germany

 

Thank you very much for having given me the chance to attend the high quality conference. Frankly, your organization is quite good which is above the level of most international conferences which I have attended so far. One suggestion is that in the future, it is better not to include most activities on Saturday and Sunday since the western men think the weekends belongs to personal free time.

-- Dr. Bao-Yu Zong, Singapore

 

It was a beautiful conference, very well organized and managed! I really have only words of appreciation! It was a very distinguished group of personalities and I am most honored to have been selected to be a part of. Thanks to you, I also had the extraordinary opportunity to visit Japan!

----Dr. Ana Maria Dabija, Romania

 

It was a real pleasure for me to participate in WCSM. It was my first visit to Japan, and I was very impressed by this country. Congress was organized very well. Thank you. I look forward to attending your future meeting in Rome.

----Dr. Sergey Nikitenko, France

 

Thank you for your kind email. It was a pleasure to be invited to your congress and really a great honour attend it with so such learned scientists. Actually I don't think you need my suggestions because everything went well. I am so happy you had chosen Italy for the next congress.

Italy

 

I really enjoyed very much this conference and all of the interesting topics included in the program. Thank you for the expert organisation of the event.

---Dr. Rita Skoda-Földes, Hungary

 

I would like to thank you again for the excellent conference. Everything was organized exceptionally well. Thank you.

I look forward to attending your future conferences. Please keep me posted.

---Dr. Reza Abbaschian, USA

 

I would like to thank you for your kind email. In my humble opinion, the conference was very organized. The only suggestion I would provide is that the speakers to have a portable microphone. That will help projecting their voice all the time even if they are explaining things on the screen.

--- Dr. Adel Alhalawani, Canada

 

We enjoyed the BKK conference very much. It was one of the most well-organized conferences which we had attended. This year the poster session was improved compared with that in the Singapore conference. Although we found some very interseting posters, we could not contact and discuss with the authors.

--- Dr. Hitoshi Kunoh, Japan

 

It was a pleasure attending to Smart Materials 2016, to visit Singapore and to be with my family. I really enjoyed it.

Regarding the congress, I enjoyed it very much, in special the session of my communication, and I learnt a lot. I only have to point the strong air conditioning. The room temperature was too low. Once I had to go outside to become warm! But it seems that is usual in Singapore.

--- Dr. Sofia Capelo, Portugal



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