WCSM-2023
★ Scientific Programme


Smart Materials-2023

Time: July 22-24, 2023

Venue: Barcelona, Spain

 

Plenary

Scientific Program

Stream 1

Stream 2

Stream 3

Stream 4

Stream 5

Poster & Paper

Stream 6

Stream 7

Stream 8

Stream 9

Stream 10

 

Please Attention:
The below program are not the confirmed version, the program will be mini changed according to the situation of each session before conference date. For the conference program layout, please click HERE

 

Stream 4: Smart Electronic Materials & Devices

  

Session 401: Electronic & Advanced Packaging Materials and Technology

Time: 08:30-12:10, July 23, 2023

Place: Catalonia Barcelona Plaza

Chair:

Dr. Igor Kadija, President & CEO, ECSI Fibrotools, USA

Co-Chair:

Call for Co-Chair
 
08:30-08:35 Chair's Introduction

08:35-09:00

 Title: Contact Electroplating Technology
Dr. Igor Kadija, President & CEO, ECSI Fibrotools, USA
09:00-09:25

Title: Physical Modeling for the Frequency Dependence of Time-Dependent Dielectric Breakdown (TDDB)

Dr. J. W. McPherson, Founder/CEO, McPherson Reliability Consulting, LLC, USA

09:25-09:50

Title: Development of PID Material for Top Thin Layer and Inner Layer Insulation
Mr. Toshizumi Yoshino, Director, Resonac Corporation, Japan
09:50-10:15

Title: Next Generation Dry Film Solder Resist for System-in-Package
Dr. Yuya Suzuki, Marketing Manager, Taiyo America, USA
10:15-10:30 Coffee Break

10:30-10:55

 Title: The Role of Materials in Storing Digital Data Permanently
Dr. Barry M. Lunt, Professor, Brigham Young University, USA
10:55-11:20

Title: The Challenges of the Electronic Packaging.
Dr. Be-nazir Khan, IXYS ICD, a part of Littelfuse Inc., USA
11:20-11:45 Speech Opportunity Available
11:45-12:10 Speech Opportunity Available

 

 

Session 402: Novel Display and Imaging Device

Time: 08:30-12:10, July 23, 2023

Place: Catalonia Barcelona Plaza

Chair:

Mr. Joe Miseli, CEO & Principal, JVM Research, USA

Co-Chair:

Call for Co-Chair
 
08:30-08:35 Chair's Introduction

08:35-09:00

Title: Evaluation of the Dynamic Performance of HDR Displays

Mr. Joe Miseli, CEO & Principal, JVM Research, USA

09:00-09:25

Title: Trends on Visual Communication Technologies towards Immersive, Natural Experiences
Dr. Seishi Takamura, Research Professor, NTT Corporation, Japan; Professor, Hosei University, Japan

09:25-09:50

Title: Applications of High-speed Imaging to Sport Dynamics
Dr. Shinichiro Ito, President, Kogakuin University, Japan
09:50-10:15

Title: Toward the Achieving Excellent Lognevity of Blue OLED device
Dr. Sangho Jeon, Principal Engineer, Samsung Display, South Korea
10:15-10:40 Speech Opportunity Available

 

 

Session 403: Stretchable and Flexible Electronic Materials & Devices

Time: 08:30-12:10, July 24, 2023

Place: Catalonia Barcelona Plaza

Chair:

Call for Chair

Co-Chair:

Call for Co-Chair
 
08:30-08:35 Chair's Introduction

08:35-09:00

Speech Opportunity Available

09:00-09:25

Title: Printed Structural Electronic and Device Integration on Metal
Dr. Guaino Philippe, Program Leader, CRM Group, Belgium

09:25-09:50

Title: Inkjet Printing of Conductive Materials on Large Substrates
Dr. Ulrich Moosheimer, Professor, Munich University of Applied Sciences, Germany

09:50-10:15

Speech Opportunity Available

 

 

Session 404: Next Generation for IT/ICT

Time: 08:30-12:10, July 24, 2023

Place: Catalonia Barcelona Plaza

Chair:

Dr. François Jeanjean, Economist, Orange, France

Co-Chair:

Call for Co-Chair
 
08:30-08:35 Chair's Introduction

08:35-09:00

Title: Innovative IT Approaches -Digitisation and Smart Vocational Learning in the Field of European Metal Industry

Dr. Marc Beutner, Chair Professor, Chair Business and Human Resource Education II, University Paderborn, Germany
09:00-09:25

Title: Technical Progress Reduces the Degree of Competition that Maximizes Investment in Innovation

Dr. François Jeanjean, Economist, Orange, France
09:25-09:50

Title: Smart Materials and Future Industrial Wireless Sensor Network: Are we really Taking Advantage on These Technological Improvements?

Mr. Richard J. R. McCullough, Managing Director, ITIBCN (DATAGROUP), Spain
09:50-10:15 Speech Opportunity Available
10:15-10:30 Coffee Break
10:30-10:55

Title: The IEEE 802.11p for VANETs

Mr. Osman Toker, Software Engineer, Havelsan A.S., Turkey
10:55-11:20 Title: Smart Ludo Trash (SLT): A Waste Sorting Education Tool: An AI-oriented Infrastructure for Detecting and Sorting Waste with Sensors
Dr. Noria Foukia, Associate Professor, HES-SO Geneve, Switzerland

11:20-11:45

Title: Next Generation Telecommunication Environment to Provide High-speed Internet Service between Heterogeneous Devices
Dr. So Ki Jung, Infra Innovation Team, South Korea
11:45-12:10 Speech Opportunity Available

 

 

Session 405: Integrated Circuit and Semiconductor

Time: 13:30-17:10, July 24, 2023   

Place: Catalonia Barcelona Plaza

Chair:

Call for Chair

Co-Chair:

Call for Co-Chair
 
13:30-13:35 Chair's Introduction
13:35-14:00 Keynote Speech
Title: TBD
Dr. Niloufar Raeis-Hosseini, Honorary Research Fellow, Imperial College London, UK

14:00-14:25

Title: Quantum Circuits and Quantization of Dc–Pumped Josephson Parametric Amplifier
Dr. Rami Ahmad El-Nabulsi, Professor, Chiang Mai University, Thailand

14:25-14:50

Title: Implement 10B Related Radiation Hardening for Flash Memory Chips

Dr. Tim Hossain, Chief Scientist, Cerium Laboratories, USA
14:50-15:15

Title: On Two Types of Porous Nanocrystalline Layers Prepared Catalytically and Electrochemically on c-Si Substrates

Dr. Emil Pincik, Researcher, Institute of Physics SAS, Slovak
15:15-15:40 Speech Opportunity Available

 

 

Session 406: Optical Communication and 5G Technology 

Time: 13:30-17:10, July 24, 2023

Place: Catalonia Barcelona Plaza

Chair:

Call for Chair

Co-Chair:

Call for Co-Chair
 
13:30-13:35 Chair's Introduction

13:35-14:00

Speech Opportunity Available

14:00-14:25

Speech Opportunity Available

14:25-14:50

Speech Opportunity Available

14:50-15:15

Speech Opportunity Available

 

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World High Technology Society


BIT Congress Inc.


BIT Convention Inc.

Supporting Organization
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Comments on WCSM Events

I enjoyed the conference and city of Rome. The conference involves wide variety of topics with many especially companies. It was exciting to me. I hope WCSM-2022 will be successful one.

---- Dr. Masaaki Niwa, Japan

 

Thank you for the wonderful conference which you and your team had organized in Osaka Japan. The talks were of really high quality and the opportunity to network amongst the participants was very beneficial.

----Dr. Brando Okolo, Germany

 

Thank you very much for having given me the chance to attend the high quality conference. Frankly, your organization is quite good which is above the level of most international conferences which I have attended so far. One suggestion is that in the future, it is better not to include most activities on Saturday and Sunday since the western men think the weekends belongs to personal free time.

-- Dr. Bao-Yu Zong, Singapore

 

It was a beautiful conference, very well organized and managed! I really have only words of appreciation! It was a very distinguished group of personalities and I am most honored to have been selected to be a part of. Thanks to you, I also had the extraordinary opportunity to visit Japan!

----Dr. Ana Maria Dabija, Romania

 

It was a real pleasure for me to participate in WCSM. It was my first visit to Japan, and I was very impressed by this country. Congress was organized very well. Thank you. I look forward to attending your future meeting in Rome.

----Dr. Sergey Nikitenko, France

 

Thank you for your kind email. It was a pleasure to be invited to your congress and really a great honour attend it with so such learned scientists. Actually I don't think you need my suggestions because everything went well. I am so happy you had chosen Italy for the next congress.

Italy

 

I really enjoyed very much this conference and all of the interesting topics included in the program. Thank you for the expert organisation of the event.

---Dr. Rita Skoda-Földes, Hungary

 

I would like to thank you again for the excellent conference. Everything was organized exceptionally well. Thank you.

I look forward to attending your future conferences. Please keep me posted.

---Dr. Reza Abbaschian, USA

 

I would like to thank you for your kind email. In my humble opinion, the conference was very organized. The only suggestion I would provide is that the speakers to have a portable microphone. That will help projecting their voice all the time even if they are explaining things on the screen.

--- Dr. Adel Alhalawani, Canada

 

We enjoyed the BKK conference very much. It was one of the most well-organized conferences which we had attended. This year the poster session was improved compared with that in the Singapore conference. Although we found some very interseting posters, we could not contact and discuss with the authors.

--- Dr. Hitoshi Kunoh, Japan

 

It was a pleasure attending to Smart Materials 2016, to visit Singapore and to be with my family. I really enjoyed it.

Regarding the congress, I enjoyed it very much, in special the session of my communication, and I learnt a lot. I only have to point the strong air conditioning. The room temperature was too low. Once I had to go outside to become warm! But it seems that is usual in Singapore.

--- Dr. Sofia Capelo, Portugal



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