Rescheduled Notice
Apart from protecting our participants, rescheduling non-essential gathering and travel also aims to contain the spread of coronavirus disease and protect the health system which will otherwise be overwhelmed. Thank you very much for your understanding in the complex situation.
Event Committee
CONFERENCE INTRODUCTION
Smart Devices Symposium 2021 (SDS2021) will provide a platform for scientists, researchers and industrial
experts worldwide to share technological advancements and business experiences. This international conference
offers the business leaders, researchers and entrepreneurs around the world to meet and exchange ideas in
research technologies, finding gaps in the devices technology development and collaborate for future
business. It serves as a great opportunity to find global partners and build up research and business
relations.
The three-day conference is an effective series of activities such as Scientific Program, Exhibitions,
Posters and Tours etc.
HIGHLIGHTS OF THE CONFERENCE
● 1 Plenary Forum from a Panel of Leading Experts in Smart Device
● 150+ Oral Presentations on the Latest Smart Device Development
● 50+ Project Posters on Smart Device & Intelligent Materials
● 300+ Professional Attendees from All over the World for Unrivalled Networking
● Opportunity to Present Your Work and Forge New Collaborations
● Tech Tour to Famous Science Spots & Cultural Landscapes in Osaka
MAIN THEMES OF THE CONFERENCE
Opening Ceremony and Keynote Forum
Theme 1: Intelligent Materials for Smart Device
Theme 2: Technology Innovation in Smart Devices
Theme 3: Smart Devices and Smart World Applications
Theme 4: Young Scientists Forum
Theme 5: Exhibition
Theme 6: Papers & Posters
Theme 7: Social Events and Cultural Activities
KEYNOTE SPEAKERS
|
Dr. Axel Scherer, |
Dr. Axel Scherer, |
Dr. Fahad Shah, |
Dr. Fahad Shah, |
|
Dr. Ramjee Prasad, |
Dr. Ramjee Prasad, |
Dr. Mohammed Safiuddin, |
Dr. Mohammed Safiuddin, |
|
Dr. Sung-Ho Salk, |
Dr. Sung-Ho Salk, |
DISTINGUISHED SPEAKERS
|
|
Mr. Eric Prevost, Vice President, Oracle, France |
|
Dr. Shiqiang Zhu, Vice President, Zhejiang University, China |
|
Dr. Aslan Yu Tsivadze, Scientific Director, Russian academy of Sciences A.N. Frumkin Institute of Physical Chemistry and Electrochemistry RAS (IPCE RAS), Russia |
|
|
Dr. M. Saiid Saiidi, Professor, University of Nevada, USA |
|
Dr. Masatoshi Kubouchi, Professor, Tokyo Institute of Technology, Japan |
|
Dr. Philip Taylor, Professor, Newcastle University, UK |
|
|
Mr. Dean DeBiase, Chairman, Reboot Partners, USA |
|
Mr. Bechtold Franz, CEO, VIA Electronic GmbH, Germany |
|
Dr. Debabrata Nayak, Chief Security Officer, Huawei Telecommunication India pvt Ltd., India |
|
|
Dr. Mehrnoosh Monshizadeh, Research Security Specialist, Nokia Bell Labs, Finland |
|
Dr. Pengcheng Jiao, Research Professor, Zhejiang University, China |
|
Dr. Martyn E Pemble, Professor, University College Cork, Ireland |
|
|
Dr. V. G. Kosushkin, Professor and Head, Bauman Moscow State Technical University, Russia |
|
Dr. Ari Visa, Professor and Vice Dean, Tampere University of Technology, Finland |
|
Dr. Vladimir Devyatkov, Professor and Head, Bauman Moscow State Technical University, Russia |
|
|
Dr. Evangelos Bekiaris, HIT Director, Centre for Research and Technology Hellas (CERTH), Greece |
|
Dr. Eduard Babulak, Professor, Liberty University, USA |
|
Dr. Vladimir G. Chigrinov, Professor, Foshan University, Emeritus Professor, Hong Kong University of Science and Technology, China |
|
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Dr. Dun-Ji Chen, Dean, National Taiwan Normal University, Taiwan |
|
Dr. Albena Mihovska, Associate Professor, Aarhus University, Denmark |
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Dr. Parameswar Harikumar, Associate Professor, University of Tulsa, USA |
|
|
Dr. Ashutosh Karna, Data Scientist, HP Inc., Spain |
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Dr. Stephan Reiff-Marganiec, Senior Lecturer, University of Leicester, UK |
|
Dr. Luca Muratore, Lead Software Engineer, Italian Institute of Technology, Italy |
|
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Prof. Dr. Vijayakumar Varadarajan, EAI Fellow, School of Computer Science and Engineering, The University of New South Wales, Sydney, Australia |
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Dr. Zhaoyang (Joe) Dong, Professor, University of New South Wales, Australia (IEEE Fellow) |
|
Mr. Filippo Di Giovanni, Strategic Marketing Manager, STMicroelectronics SRL, Italy |
WHO SHOULD ATTEND
● Eminent Scientists of Smart Device and Intelligent Materials
● Smart Device and Intelligent Materials Research Professors and Research Fellows
● Students from Smart Device and Intelligent Materials
● Directors of Smart Device Manufacturing Companies
● Smart Device Processing Engineers
● Members of Different Smart Device & Intelligent Materials Associations
INTRODUCTION OF OSAKA
Having the first signs of human life and habitation, Osaka is one of the historical cities in the world and it was the first capital of Japan. Covering an area of approximately 1899 Km, Osaka is the home of around 8.8 million citizens. Facing the bay at the west, it is surrounded by mountains on the other three sides. Osaka has been the gateway to overseas and the center of Japan's economy since ancient times. In recent years, it has been instrumental in adding traction to Japan's economy as a leader of the industrial revolution, and this has produced a large number of major industries and corporations. One of the main feature of Osaka Prefecture's industry is that it is regarded as the Region for Small and Medium-Sized Enterprises (SMEs). SMEs account for approximately 65% of industrial production in Osaka, and many of these claim a large share of the world's markets with their unique home-grown technology.
National Foreign Experts Databank of MOST (Dalian Branch)
Dr. Norman C. Beaulieu, Professor, Beijing University of Posts and Telecommunications, China
International Journal of Computational Intelligence Research
The International Journal of Computational Intelligence Research (IJCIR) is a peer reviewed international journal with a key objective to provide medium for presenting original cutting edge research related to computational intelligence and its applications. IJCIR is inviting original and unpublished current research on computational intelligence both the theoretical and methodological aspects, as well as various applications in real world problems from science, technology, business or commerce.
Indexing: ACM Computing, DBLP, EBSCOhost, Google Scholar, JournalSeek, ICI Index Copernicus
| Fee | $85 | Review Time | 4 weeks |
| I.F. | 2.36 | Manuscript | Dec 25, 2019 |
| Print ISSN | 0973-1873 | Full Paper | Jan 15, 2020 |
| Online ISSN | 0974-1259 | Final Review | Feb 25, 2020 |
Materials
Materials (ISSN 1996-1944) is an open access journal of related scientific research and technology development. It publishes reviews, regular research papers (articles) and short communications. Our aim is to encourage scientists to publish their experimental and theoretical results in as much detail as possible. Materials provides a forum for publishing papers which advance the in-depth understanding of the relationship between the structure, the properties or the functions of all kinds of materials. Chemical syntheses, chemical structures and mechanical, chemical, electronic, magnetic and optical properties and various applications will be considered.
| Indexing: | SCIE, EI, Scopus, PubMed | ||
| Fee | 2000 CHF | Review Time | 3-4 Weeks |
| Fee | 2000 CHF | Review Time | 3-4 Weeks |
| I.F. | 3.057 | Manuscript | April 01, 2021 |
| Print ISSN | 1996-1944 | Full Paper | April 15, 2021 |
| Online ISSN | MATEG9 | Final Review | May 15, 2021 |
Intelligent Information Management
IIM is a peer reviewed international journal dedicated to the latest advancements of intelligent information management. The goal of this journal is to keep a record of the state-of-the-art research and promote the research work in these fast moving areas. The topics include but are not limited to Business Intelligence, Computational Intelligence, Intelligent Data Mining, Distributed Intelligent Information System from Massive Data, Intelligent Scheduling, Smart Grids, and other related areas.
Indexing: Web of Science (Clarivate Analytics), Google Scholar, Academic Journals Database, AiritiLibrary, Base Search, Blyun CALIS, Citefactor, CNKI SCHOLAR, COPAC, CrossRef, DTU Findit, Elektronische, Zeitschriftenbibliothek(EZB), GETIT@YALE(Yale University Library), Harvard Library E-Journals, Infotrieve, i-Scholar, JournalTOCs, MIAR, National Center for Philosophy and Social Sciences Documentation, National Science and Technology Library(NSTL), Open Access Journals Search Engine(OAJSE), Open Access Library, Open J-Gate, Polish Scholarly Bibliography (PBN), PubMed, PubMed Central, QUALIS/CAPES, Research Bible, ResearchGate, SciLit, Stanford University Libraries, Technische Informationsbibliothek (TIB), The Library of Congress,Ulrich's Periodicals Directory, WanFang, WRLC Catalog, Zeitschriftendatenbank (ZDB)
| Fee | $499 | Review Time | 20 Days |
| I.F. | 0.84 | Manuscript | Jan 10, 2020 |
| Print ISSN | 2160-5912 | Full Paper | Jan 15, 2020 |
| Online ISSN | 2160-5920 | Final Review | Feb 25, 2020 |
Open Journal of Composite Materials
Open Journal of Composite Materials (OJCM) is a peer reviewed international journal dedicated to the latest advancements in kinds of composite materials. Composite materials are widely used in various fields and have major industrial, economic, technological and social impact in our daily life. OJCM invites authors to submit their original and unpublished work that shares current research on composite materials, as well as various applications in our work and life.
Indexing: Web of Science (Clarivate Analytics), Google Scholar, Academic Journals Database, Airiti Library , Base Search , Blyun , CALIS , ChaoXing Periodicals , Chemical Abstracts Service(CAS) , Citefactor, CNKI SCHOLAR, COPAC, CrossRef, DTU Findit , Elektronische Zeitschriftenbibliothek (EZB), GETIT@YALE Yale University Library, Infotrieve, i-Scholar, JournalSeek, JournalTOCs, National Science and Technology, Library(NSTL), Open Access Journals Search Engine(OAJSE), Open J-Gate, Polish Scholarly Bibliography (PBN), Research Bible, SciFinder, SciLit, SHERPA/RoMEO, Stanford University Libraries, Système Universitaire de Documentation (Sudoc), Technische Informationsbibliothek (TIB), Ulrich's Periodicals Directory, WanFang, Worldcat, WRLC Catalog, Zeitschriftendatenbank (ZDB)
| Fee | $499 | Review Time | 20 Days |
| I.F. | 2.22 | Manuscript | Jan 10, 2020 |
| Print ISSN | 2164-5612 | Full Paper | Feb 1, 2020 |
| Online ISSN | 2164-5655 | Final Review | Mar 1, 2020 |
Advances in Nanoparticles
Advances in Nanoparticles (ANP) is an open access journal. The goal of is to promote, share, and discuss various new issues and developments in all aspects of nanoparticle science and technology and their applications. All papers are subject to a rigorous peer-review process. Generally, accepted papers will appear online within 3 weeks followed by printed hard copy.
Indexing: Web of Science (Clarivate Analytics), Google Scholar, ABC Chemistry, Base Search , Blyun , CALIS , ChaoXing Periodicals , Chemical Abstracts Service(CAS) , Citefactor, CNKI SCHOLAR, COPAC, Elektronische Zeitschriftenbibliothek (EZB), Geneva Foundation for Medical Education and Research, Infotrieve, i-Scholar, JournalTOCs, National Science and Technology, Open J-Gate, Polish Scholarly Bibliography (PBN), Research Bible, SciFinder, SciLit, SHERPA/RoMEO, Système Universitaire de Documentation (Sudoc), Ulrich’s Periodicals Directory, WanFang, Worldcat, WRLC Catalog, Zeitschriftendatenbank (ZDB)
| Fee | $499 | Review Time | 20 Days |
| I.F. | 2.32 | Manuscript | Jan 10, 2020 |
| Print ISSN | 2169-0510 | Full Paper | Feb 1, 2020 |
| Online ISSN | 2169-0529 | Final Review | Mar 1, 2020 |
● Call for speakers, exhibitors and sponsors worldwide.
● Call for media partners and advertiser worldwide.
● Call for papers
Add: Life Science Innovation Center BLD 3-2, 43 Torch Road, High Tech Park, Dalian, LN 116023, China
Tel: 0086-411-84799609, Fax: 0086-411-84796897
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