BIT’s 5th Annual World Congress of Smart Materials-2019 (WCSM-2019)
★ Scientific Programme

BIT’s 5th Annual World Congress of

SmartMaterials -2019

Theme: Intelligent Upgrading for a Smart Future

Time: March 6-8, 2019

Venue: Rome, Italy


Scientific Program

Forum 1

Forum 2

Forum 3

Forum 4

Forum 5

Forum 6

Forum 7

Forum 8

Posters & Papers


Please Attention:
The below program are not confirmed version, the program will be changed according to the situation of each session before conference date. If any special requirements on the speech date, please contact the coordinator in advance. For the conference program layout, please click HERE.


Opening Ceremony & Keynote Forum
Time: 09:00-12:00, Mar. 6, 2019 (Wednesday)
Place: Loggia Dei Signori, Ground Floor, Sheraton Parco 1, Rome, Italy
Moderator: Dr. Florin Udrea, Fellow, Royal Academy of Engineering; Head, High Voltage Microelectronics and Sensors Lab, Cambridge University, UK
FaceOn Speeches and Speakers
˵��: C:\Users\Administrator\Desktop\fefef.bmp Title: Silicon Carbide: Smart Material for Power Electronics
Dr. Bantval Jayant Baliga, Distinguished University Professor, North Carolina State University, USA; Member, National Academy of Engineering, USA; Fellow, IEEE, USA

Title: Semiconductor Nanostructures for Modern Electronics

Dr. Alexander Aseev, Academician, Russian Academy of Sciences, Russia; Chief Scientist, Novosibirsk State University, Russia

Title: Network Implications of Wireline and Wireless Convergence

Mr. Robert Whitman, Vice President Global Carrier Networks Market Development, Corning Optical Communications, USA

Title: Graphene Flagship - A Journey from Laboratory towards Factory Floor

Dr. Kari Hjelt, Head of Innovation, Graphene Flagship, Sweden


News Updates
Conference Schedule was Released
Conference Final Program was released
The WCAM-2020 will be held in Barcelona, Spain, during March 11-13, 2020
Hosting Organizations

BIT Congress Inc.


Murata Machinery, Ltd., Japan

SIA P&M-Invest Ltd., Russia

aixACCT Systems GmbH, Germany

Company List

NETZSCH-Feinmahltechnik, Germany

ViscoTec Pumpen- u. Dosiertechnik GmbH, Germany


Sion Power Corporation, USA

i-CORE Technology, LLC., USA

Arterius Ltd., UK

MCA Technologies GmbH, Switzerland

Cleanpart Group GmbH, Germany

Future-Shape GmbH, Germany

3DCeram, France

Kao Corporation, Japan

Trent Capital Management, USA

Official Travel Agency

BIT World Travel Service, Inc.

Media Partners

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